Auto Aligner

Auto AlignerMA4200 exposure system is an all function in one facility printing patterns on photoresist-coated substrates aligned with a mask. MA4200 provides a fully automatic and high-speedy system on substrate loading, alignment, exposure and unloading to increase production efficiency which is ideal for LED, wafer Mems Industries.

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DNK Stepper

DNK StepperDDNK Stepper has high precision alignment and the corresponding module system to alter the optical parameters, in accordance with different objects to convert NA on projection lens, aperture of illumination optical system (8 Sigma) and the exposure wavelength (λ); with different exposure objects, DNK stepper is able to convert to different depth of focus to achieve high-depth exposure which can be manufactured in MEMS, LED etc. During 3-dimensional device test, it can correspond to different degrees on photo-resist thick film and waves. DNK stepper also fully supports wafer evaluation and selection and provides professional laboratory sample wafers test through DNK specialized expertise.

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Auto Spin Coater/Developer

Auto Spin CoaterMSX1000 is named modular spin system especially designed for electro-optical industry, and semi-conductor sector. It is suitable for 2”~4”wafer and applicable for ASICS, LED, OLED, MEMS processes.

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Plasma Surface Treatment Cleaning System

Plasma Surface Treatment Cleaning SystemTePla is dedicated to innovate advanced plasma system and provide outstanding OLED/PLED glass surface treatment cleaning, activation and modification (Hydrophilic/ hydrophobic surface) and professional ITO electrode, PCB, industrial electron, printing surface cleaning technology, which is an ideal facility for surface cleaning and modification.

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HMDS Oven

HMDS OvenSVS HMDS vacuum oven applies HMDS vapor priming on wafer surface uniformly. During this priming/ baking process, the wafer surface is baked to be completely free of moisture, effectively rising as well as maximizing adhesion of the phototresist; also, the vapor exposed by HMDS can significantly reduce wafer contamination issue rather than liquid spin priming and provide excellent line uniformity for next step of wafer coating.

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